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MOUNTAIN VIEW, Calif., Jan. 7, 2014 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the release of the CEVA-TeakLite-4 v2 DSP architecture, further boosting the performance and lowering the power consumption of the world's most popular DSP architecture for audio/voice applications.

(MARKETWIRE via COMTEX)

-- Tensilica(R), Inc. today announced the immediate availability of Dolby(R) Volume on its popular HiFi Audio DSP (digital signal processors). The implementation is based on software developed by Dolby and has passed Dolby's certification. Dolby Volume enables designers of SOCs (systems on chips) for home entertainment systems and digital televisions, and for handsets with mobile DTV, to provide viewers with a consistent playback volume level across all sources and content.

SANTA CLARA, Calif. USA – February 11, 2009 – Tensilica, Inc. today announced the immediate availability of the Bluetooth sub-band codec (SBC) decoder and encoder for its popular HiFi 2 Audio DSP, which can easily be integrated into system-on-chip (SOC) designs. Now designers of cellular phones, portable music players and other devices can easily design in Bluetooth capabilities, along with over 50 other audio standards already available, that run on the HIFi 2 Audio DSP.

SANTA CLARA, Calif. – September 16, 2008 – Tensilica, Inc. today announced that it has added the AMR WB+ audio / speech decoder and encoder to the software library for its HiFi 2 audio processor. The AMR WB+ (Adaptive Multi Rate Wideband plus) speech codec improves on the available AMR Wideband speech codec by adding support for stereo signals and higher sampling rates, providing higher quality at low bit rates.