Taiwan's chip behemoth, which dominates the Chinese market, is now intent on establishing a foothold in the United States in addition to Europe and Japan. For that, the company has new ammo: a multimode-LTE modem chipset, currently going through operators' arduous certification process; and an advanced "worldphone" SoC that will incorporate CDMA2000. But the commercial version of the worldphone won't hit the market until early 2015.
News Archive
MOUNTAIN VIEW, Calif., Jan. 7, 2014 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the release of the CEVA-TeakLite-4 v2 DSP architecture, further boosting the performance and lowering the power consumption of the world's most popular DSP architecture for audio/voice applications.
P-Product, Inc., a software design center specializing in developing, optimizing and porting audio, video and communications algorithms and applications for various platforms, and ASOCS Ltd., a silicon IP provider of software-defined radio (SDR) solutions, today announced a partnership to develop an SDR-based solution for Node B 3G base stations for the mobile infrastructure market.
(MARKETWIRE via COMTEX)
-- Tensilica(R), Inc. today announced the immediate availability of Dolby(R) Volume on its popular HiFi Audio DSP (digital signal processors). The implementation is based on software developed by Dolby and has passed Dolby's certification. Dolby Volume enables designers of SOCs (systems on chips) for home entertainment systems and digital televisions, and for handsets with mobile DTV, to provide viewers with a consistent playback volume level across all sources and content.
CEVA-XCnet™ brings together critical technology enablers for SoC design based on CEVA-XC™ processor
PRNewswire
SAN JOSE, Calif.
(NASDAQ-NMS:CEVA)
SAN JOSE, Calif., Feb. 8 /PRNewswire-FirstCall/ -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced its CEVA-XCnet Partnership Program, a comprehensive network of strategic third-party technology suppliers that together form a robust infrastructure around the CEVA-XC communications processor.
SANTA CLARA, Calif. USA – February 11, 2009 – Tensilica, Inc. today announced the immediate availability of the Bluetooth sub-band codec (SBC) decoder and encoder for its popular HiFi 2 Audio DSP, which can easily be integrated into system-on-chip (SOC) designs. Now designers of cellular phones, portable music players and other devices can easily design in Bluetooth capabilities, along with over 50 other audio standards already available, that run on the HIFi 2 Audio DSP.
SANTA CLARA, Calif. – December 2, 2008 – Tensilica, Inc. today announced that P-Product, of Needham, MA, has joined Tensilica’s Xtensions Partner network as an authorized software design center, specializing in efficient implementations of digital signal processing (DSP) software. P-Product has extensive expertise in audio and video as well as in WiMAX and LTE. P-Product has already ported multiple audio software modules to Tensilica’s popular HiFi 2 Audio Engine.
SANTA CLARA, Calif. – September 16, 2008 – Tensilica, Inc. today announced that it has added the AMR WB+ audio / speech decoder and encoder to the software library for its HiFi 2 audio processor. The AMR WB+ (Adaptive Multi Rate Wideband plus) speech codec improves on the available AMR Wideband speech codec by adding support for stereo signals and higher sampling rates, providing higher quality at low bit rates.
SANTA CLARA , Calif. – September 10, 2007 – Tensilica, Inc. today announced that P-Product has joined its Xtensions partner network. P-Product has already ported audio software to Tensilica's HiFi 2 Audio Engine and has significant expertise in audio and video software porting.
Pages
- « first
- ‹ previous
- 1
- 2
- 3