News Archive
Cadence executives and partners to present and demonstrate the latest processors, IP and more
SAN JOSE, Calif., 17 Feb 2015
WHO:
Cadence Design Systems, Inc. (NASDAQ:CDNS) is scheduled to demonstrate its latest advancements and solutions for mobile technology challenges, in collaboration with customers and partners, at Mobile World Congress (MWC) 2015. To sign up for a private demo or discussion at the show, email: mfoster@cadence.com.
WHEN:
March 2 - March 6, 2015
WHERE:
Visit Cadence at Mobile World Congress 2015, in Barcelona, Spain:
Cadence® booth, Hall 6, Stand 6L36
WHAT:
Visit Cadence’s booth to see demonstrations of the industry’s highest performance and most energy-efficient audio/voice digital signal processing (DSP) intellectual property (IP) cores for system-on-chip (SoC) designs. Visitors can see the Tensilica® HiFi Audio/Voice DSP IP cores as well as fully integrated IP sub-systems featuring Tensilica image/video processor DSP, automotive Ethernet IP, and IP for MIPI protocols.